Polymeric materials

ABSTRACT

A submersible component can include a conductor; and a polymeric material disposed about at least a portion of the conductor where the polymeric material includes at least approximately 50 percent by weight polyether ether ketone (PEEK) and at least 5 percent by weight perfluoroalkoxy alkanes (PFA). A submersible electrical unit can include an electrically conductive winding; and a polymeric composite material disposed about at least a portion of the electrically conductive winding where the polymeric composite material includes polymeric material at at least approximately 40 percent by volume and one or more fillers at at least approximately 10 percent by volume.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. application Ser.No. 15/227,737, filed Aug. 3, 2016, the entirety of which is herebyincorporated by reference herein.

BACKGROUND

A conductor can conduct electricity or, for example, electromagneticenergy (e.g., consider an optical fiber). A conductor can be coated witha material that acts to insulate the conductor. As an example, such amaterial may be a dielectric material, which may be, for example, apolymeric material. As an example, a polymeric material may be suitablefor use as a varnish and/or an encapsulant. For example, consider amagnet wire varnish and an electric motor stator encapsulant.

SUMMARY

A submersible component can include a conductor; and a polymericmaterial disposed about at least a portion of the conductor where thepolymeric material includes at least approximately 50 percent by weightpolyether ether ketone (PEEK) and at least 5 percent by weightperfluoroalkoxy alkanes (PFA). A submersible electrical unit can includean electrically conductive winding; and a polymeric composite materialdisposed about at least a portion of the electrically conductive windingwhere the polymeric composite material includes polymeric material at atleast approximately 40 percent by volume and one or more fillers at atleast approximately 10 percent by volume. Various other apparatuses,systems, methods, etc., are also disclosed.

This summary is provided to introduce a selection of concepts that arefurther described below in the detailed description. This summary is notintended to identify key or essential features of the claimed subjectmatter, nor is it intended to be used as an aid in limiting the scope ofthe claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

Features and advantages of the described implementations can be morereadily understood by reference to the following description taken inconjunction with the accompanying drawings.

FIG. 1 illustrates examples of equipment in geologic environments;

FIG. 2 illustrates an example of an electric submersible pump system;

FIG. 3 illustrates examples of equipment;

FIG. 4 illustrates an example of a system that includes a motor;

FIG. 5 illustrates examples of equipment;

FIG. 6 illustrates examples of equipment;

FIG. 7 illustrates examples of equipment;

FIG. 8 illustrates an example of an insulated conductor;

FIG. 9 illustrates examples of methods;

FIG. 10 illustrates an example of a plot of data;

FIG. 11 illustrates an example of a plot of data;

FIG. 12 illustrates an example of a plot of data;

FIG. 13 illustrates an example of a plot of data;

FIG. 14 illustrates an example of a plot of data;

FIG. 15 illustrates an example of a plot of data;

FIG. 16 illustrates an example of a plot of data;

FIG. 17 illustrates an example of a plot of data;

FIG. 18 illustrates an example of a plot of data;

FIG. 19 illustrates an example of a plot of data;

FIG. 20 illustrates an example of a plot of data;

FIG. 21 illustrates an example of a plot of data;

FIG. 22 illustrates an example of a plot of data;

FIG. 23 illustrates an example of a plot of data;

FIG. 24 illustrates an example of a plot of data; and

FIG. 25 illustrates example components of a system and a networkedsystem.

DETAILED DESCRIPTION

The following description includes the best mode presently contemplatedfor practicing the described implementations. This description is not tobe taken in a limiting sense, but rather is made merely for the purposeof describing the general principles of the implementations. The scopeof the described implementations should be ascertained with reference tothe issued claims.

FIG. 1 shows an example of a geologic environment 120 and examples ofequipment 150 and 170. In FIG. 1, the geologic environment 120 may be asedimentary basin that includes layers (e.g., stratification) thatinclude a reservoir 121 and that may be, for example, intersected by afault 123 (e.g., or faults). As an example, the geologic environment 120may be outfitted with any of a variety of sensors, detectors, actuators,etc. For example, equipment 122 may include communication circuitry toreceive and to transmit information with respect to one or more networks125. Such information may include information associated with downholeequipment 124, which may be equipment to acquire information, to assistwith resource recovery, etc. Other equipment 126 may be located remotefrom a well site and include sensing, detecting, emitting or othercircuitry. Such equipment may include storage and communicationcircuitry to store and to communicate data, instructions, etc. As anexample, one or more satellites may be provided for purposes ofcommunications, data acquisition, etc. For example, FIG. 1 shows asatellite in communication with the network 125 that may be configuredfor communications, noting that the satellite may additionally oralternatively include circuitry for imagery (e.g., spatial, spectral,temporal, radiometric, etc.).

FIG. 1 also shows the geologic environment 120 as optionally includingequipment 127 and 128 associated with a well that includes asubstantially horizontal portion that may intersect with one or morefractures 129. For example, consider a well in a shale formation thatmay include natural fractures, artificial fractures (e.g., hydraulicfractures) or a combination of natural and artificial fractures. As anexample, a well may be drilled for a reservoir that is laterallyextensive. In such an example, lateral variations in properties,stresses, etc. may exist where an assessment of such variations mayassist with planning, operations, etc. to develop the reservoir (e.g.,via fracturing, injecting, extracting, etc.). As an example, theequipment 127 and/or 128 may include components, a system, systems, etc.for fracturing, seismic sensing, analysis of seismic data, assessment ofone or more fractures, etc.

As to the equipment 150, an electric motor 160 can include bundles 162of wires 164. For example, the wires 164 can be magnet wires. Magnetwire can include electrically conductive material such as anelectrically conductive metal or alloy material. For example, considercopper or aluminum as electrically conductive material. As an example,magnet wire can be insulated with a layer or layers of insulation orinsulations. As an example, magnet wire may be used to construct varioustypes of equipment such as, for example, transformers, inductors,motors, speakers, hard disk head actuators, electromagnets, and otherapplications that can include coils of insulated wire. As an example,magnet wire may be electrically insulated with material that isextruded, taped, etc. As an example, magnet wire can be wound to form awinding such as, for example, a phase winding of a stator, which may be,for example, vacuum impregnated with an insulating varnish to improveinsulation strength and long-term reliability of the winding. As anexample, materials can include an electrically insulating material, avarnish material and/or an encapsulating material.

As an example, magnet wire may have a round cross section, a rectangularcross section, a hexagonal cross section (e.g., with rounded corners) orone or more types of cross sections, which may provide for one or moreof packing efficiency, structural stability, thermal conductivity, etc.

As shown in the example of FIG. 1, the electric motor 160 may be amultiphase electric motor (e.g., a polyphase electric motor). Forexample, polyphase power may be delivered via one or more power cablesto drive an induction motor where the polyphaser power generates arotating magnetic field. As an example, where a three-or-more-phasesupply completes one full cycle, a magnetic field of atwo-poles-per-phase motor can be rotated through 360 degrees in physicalspace. As an example, a motor may be a single-phase motor. As anexample, a motor may be an AC motor. As an example, a motor may be a DCmotor.

As to the equipment 170, it can include one or more conductors 180 thatmay be operatively coupled to one or more actuators 182, one or moresensors 184 and/or one or more other types of electrical components 186(e.g., electrical, electro-mechanical, electro-chemical,electro-fluidic, etc.). As an example, one or more polymeric materials,optionally one or more polymeric composite materials, may be utilized inthe equipment 170 and/or in one or more components (e.g., cables,sensors, etc.) operatively coupled to the equipment 170.

As an example, equipment can include wireline equipment. For example,consider equipment that is operatively coupled to an electrical cablethat can lower the equipment into a borehole where the equipment mayalso include transmission circuitry that can transmit and/or receiveinformation via the electrical cable.

As an example, a wireline operation can include using single-strandand/or multi-strand wire or cable for intervention in a borehole (e.g.,consider oil and/or gas wells). As an example, a wireline operation caninclude electric logging via one or more cables that include electricalconductors.

As an example, the equipment 150 may be or include artificial liftequipment. For example, the electric motor 160 may be an electric motorof an electric submersible pump (e.g., an ESP). In such an example, acable or cables may extend from surface equipment to the equipment 150,for example, to provide power, to carry information, to senseinformation, etc.

As an example, equipment can include an electric downhole motor, anelectric downhole wireline tool (e.g., or slickline tool), a cable, etc.

Conditions in a geologic environment may be transient and/or persistent.Where equipment is placed within a geologic environment, longevity ofthe equipment can depend on characteristics of the environment and, forexample, duration of use of the equipment as well as function of theequipment. Where equipment is to endure in an environment over anextended period of time, uncertainty may arise in one or more factorsthat could impact integrity or expected lifetime of the equipment. As anexample, where a period of time may be of the order of decades,equipment that is intended to last for such a period of time may beconstructed to endure conditions imposed thereon, whether imposed by anenvironment or environments and/or one or more functions of theequipment itself.

As an example, an environment may be a harsh environment, for example,an environment that may be classified as being a high-pressure andhigh-temperature environment (HPHT). A so-called HPHT environment mayinclude pressures up to about 138 MPa (e.g., about 20,000 psi) andtemperatures up to about 205 degrees C. (e.g., about 400 degrees F. andabout 480 K), a so-called ultra-HPHT environment may include pressuresup to about 241 MPa (e.g., about 35,000 psi) and temperatures up toabout 260 degrees C. (e.g., about 500 degrees F. and about 530 K) and aso-called HPHT-hc environment may include pressures greater than about241 MPa (e.g., about 35,000 psi) and temperatures greater than about 260degrees C. (e.g., about 500 degrees F. and about 530 K). As an example,an environment may be classified based in one of the aforementionedclasses based on pressure or temperature alone. As an example, anenvironment may have its pressure and/or temperature elevated, forexample, through use of equipment, techniques, etc. For example, a SAGDoperation may elevate temperature of an environment (e.g., by 100degrees C. or more; about 370 K or more).

As mentioned, magnet wire may be part of equipment and/or operativelycoupled to equipment. As to motorized equipment, various examples ofelectric submersible pump (ESP) equipment are described; noting thatmagnet wire or other relatively small gauge wire can be utilized inand/or in association with one or more types of equipment.

FIG. 2 shows an example of an ESP system 200 that includes an ESP 210 asan example of equipment that may be placed in a geologic environment. Asan example, an ESP may be expected to function in an environment over anextended period of time (e.g., optionally of the order of years).

In the example of FIG. 2, the ESP system 200 includes a network 201, awell 203 disposed in a geologic environment (e.g., with surfaceequipment, etc.), a power supply 205, the ESP 210, a controller 230, amotor controller 250 and a VSD unit 270. The power supply 205 mayreceive power from a power grid, an onsite generator (e.g., natural gasdriven turbine), or other source. The power supply 205 may supply avoltage, for example, of about 4.16 kV.

As shown, the well 203 includes a wellhead that can include a choke(e.g., a choke valve). For example, the well 203 can include a chokevalve to control various operations such as to reduce pressure of afluid from high pressure in a closed wellbore to atmospheric pressure. Awellhead may include one or more sensors such as a temperature sensor, apressure sensor, a solids sensor, etc.

As to the ESP 210, it is shown as including cables 211 (e.g., or acable), a pump 212, gas handling features 213, a pump intake 214, amotor 215, one or more sensors 216 (e.g., temperature, pressure, strain,current leakage, vibration, etc.) and a protector 217.

As an example, an ESP may include a REDA™ HOTLINE™ high-temperature ESPmotor. Such a motor may be suitable for implementation in a thermalrecovery heavy oil production system, such as, for example, SAGD systemor other steam-flooding system.

As an example, an ESP motor can include a three-phase squirrel cage withtwo-pole induction. As an example, an ESP motor may include steel statorlaminations that can help focus magnetic forces on rotors, for example,to help reduce energy loss. As an example, stator windings can includecopper and insulation.

As an example, the one or more sensors 216 of the ESP 210 may be part ofa digital downhole monitoring system. For example, consider thecommercially available PHOENIX™ MULTISENSOR XT150 system marketed bySchlumberger Limited (Houston, Tex.). A monitoring system may include abase unit that operatively couples to an ESP motor (see, e.g., the motor215), for example, directly, via a motor-base crossover, etc. As anexample, such a base unit (e.g., base gauge) may measure intakepressure, intake temperature, motor oil temperature, motor windingtemperature, vibration, currently leakage, etc. As explained withrespect to FIG. 4, a base unit may transmit information via a powercable that provides power to an ESP motor and may receive power via sucha cable as well.

As an example, a remote unit may be provided that may be located at apump discharge (e.g., located at an end opposite the pump intake 214).As an example, a base unit and a remote unit may, in combination,measure intake and discharge pressures across a pump (see, e.g., thepump 212), for example, for analysis of a pump curve. As an example,alarms may be set for one or more parameters (e.g., measurements,parameters based on measurements, etc.).

Where a system includes a base unit and a remote unit, such as those ofthe PHOENIX™ MULTISENSOR XT150 system, the units may be linked viawires. Such an arrangement provide power from the base unit to theremote unit and allows for communication between the base unit and theremote unit (e.g., at least transmission of information from the remoteunit to the base unit). As an example, a remote unit is powered via awired interface to a base unit such that one or more sensors of theremote unit can sense physical phenomena. In such an example, the remoteunit can then transmit sensed information to the base unit, which, inturn, may transmit such information to a surface unit via a power cableconfigured to provide power to an ESP motor.

In the example of FIG. 2, the well 203 may include one or more wellsensors 220, for example, such as the commercially available OPTICLINE™sensors or WELLWATCHER BRITEBLUE™ sensors marketed by SchlumbergerLimited (Houston, Tex.). Such sensors are fiber-optic based and canprovide for real time sensing of temperature, for example, in SAGD orother operations. As shown in the example of FIG. 1, a well can includea relatively horizontal portion. Such a portion may collect heated heavyoil responsive to steam injection. Measurements of temperature along thelength of the well can provide for feedback, for example, to understandconditions downhole of an ESP. Well sensors may extend a considerabledistance into a well and possibly beyond a position of an ESP.

In the example of FIG. 2, the controller 230 can include one or moreinterfaces, for example, for receipt, transmission or receipt andtransmission of information with the motor controller 250, a VSD unit270, the power supply 205 (e.g., a gas fueled turbine generator, a powercompany, etc.), the network 201, equipment in the well 203, equipment inanother well, etc.

As shown in FIG. 2, the controller 230 may include or provide access toone or more modules or frameworks. Further, the controller 230 mayinclude features of an ESP motor controller and optionally supplant theESP motor controller 250. For example, the controller 230 may includethe UNICONN™ motor controller 282 marketed by Schlumberger Limited(Houston, Tex.). In the example of FIG. 2, the controller 230 may accessone or more of the PIPESIM™ framework 284, the ECLIPSE™ framework 286marketed by Schlumberger Limited (Houston, Tex.) and the PETREL™framework 288 marketed by Schlumberger Limited (Houston, Tex.) (e.g.,and optionally the OCEAN™ framework marketed by Schlumberger Limited(Houston, Tex.)).

In the example of FIG. 2, the motor controller 250 may be a commerciallyavailable motor controller such as the UNICONN™ motor controller. TheUNICONN™ motor controller can connect to a SCADA system, the ESPWATCHER™surveillance system, etc. The UNICONN™ motor controller can perform somecontrol and data acquisition tasks for ESPs, surface pumps or othermonitored wells. As an example, the UNICONN™ motor controller caninterface with the aforementioned PHOENIX™ monitoring system, forexample, to access pressure, temperature and vibration data and variousprotection parameters as well as to provide direct current power todownhole sensors. The UNICONN™ motor controller can interface with fixedspeed drive (FSD) controllers or a VSD unit, for example, such as theVSD unit 270.

For FSD controllers, the UNICONN™ motor controller can monitor ESPsystem three-phase currents, three-phase surface voltage, supply voltageand frequency, ESP spinning frequency and leg ground, power factor andmotor load.

For VSD units, the UNICONN™ motor controller can monitor VSD outputcurrent, ESP running current, VSD output voltage, supply voltage, VSDinput and VSD output power, VSD output frequency, drive loading, motorload, three-phase ESP running current, three-phase VSD input or outputvoltage, ESP spinning frequency, and leg-ground.

In the example of FIG. 2, the ESP motor controller 250 includes variousmodules to handle, for example, backspin of an ESP, sanding of an ESP,flux of an ESP and gas lock of an ESP. The motor controller 250 mayinclude any of a variety of features, additionally, alternatively, etc.

In the example of FIG. 2, the VSD unit 270 may be a low voltage drive(LVD) unit, a medium voltage drive (MVD) unit or other type of unit(e.g., a high voltage drive, which may provide a voltage in excess ofabout 4.16 kV). As an example, the VSD unit 270 may receive power with avoltage of about 4.16 kV and control a motor as a load with a voltagefrom about 0 V to about 4.16 kV. The VSD unit 270 may includecommercially available control circuitry such as the SPEEDSTAR™ MVDcontrol circuitry marketed by Schlumberger Limited (Houston, Tex.).

FIG. 3 shows cut-away views of examples of equipment such as, forexample, a portion of a pump 320, a protector 370, a motor 350 of an ESPand a sensor unit 360. In the examples of FIG. 3, each of the pieces ofequipment may be considered to be assemblies that, for example, can beoperatively coupled to form a system (e.g., an ESP or ESP system). InFIG. 3, the pump 320, the protector 370, the motor 350 and the sensorunit 360 are shown with respect to cylindrical coordinate systems (e.g.,r, z, Θ). Various features of equipment may be described, defined, etc.with respect to a cylindrical coordinate system. As an example, a lowerend of the pump 320 may be coupled to an upper end of the protector 370,a lower end of the protector 370 may be coupled to an upper end of themotor 350 and a lower end of the motor 350 may be coupled to an upperend of the sensor unit 360 (e.g., via a bridge or other suitablecoupling).

As shown in FIG. 3, a shaft segment of the pump 320 may be coupled via aconnector to a shaft segment of the protector 370 and the shaft segmentof the protector 370 may be coupled via a connector to a shaft segmentof the motor 350. As an example, an ESP may be oriented in a desireddirection, which may be vertical, horizontal or other angle (e.g., asmay be defined with respect to gravity, etc.). Orientation of an ESPwith respect to gravity may be considered as a factor, for example, todetermine ESP features, operation, etc.

As shown in FIG. 3, the motor 350 is an electric motor that includes aconnector 352, for example, to operatively couple the electric motor toa multiphase power cable, for example, optionally via one or more motorlead extensions. Power supplied to the motor 350 via the connector 352may be further supplied to the sensor unit 360, for example, via a wyepoint of the motor 350 (e.g., a wye point of a multiphase motor).

As an example, a connector may include features to connect one or moretransmission lines, optionally dedicated to a monitoring system. Forexample, the connector 352 may include a socket, a pin, etc., that cancouple to a transmission line dedicated to the sensor unit 360. As anexample, the sensor unit 360 can include a connector that can connectthe sensor unit 360 to a dedicated transmission line or lines, forexample, directly and/or indirectly.

As an example, the motor 350 may include a transmission line jumper thatextends from the connector 352 to a connector that can couple to thesensor unit 360. Such a transmission line jumper may be, for example,one or more conductors, twisted conductors, an optical fiber, opticalfibers, a waveguide, waveguides, etc. As an example, the motor 350 mayinclude a high-temperature optical material that can transmitinformation. In such an example, the optical material may couple to oneor more optical transmission lines and/or to one or moreelectrical-to-optical and/or optical-to-electrical signal converters.

In the examples of FIG. 3, one or more coated electrical conductors maybe present. For example, the pump 320 may include one or more coatedelectrical conductors operatively coupled to and/or part of sensorcircuitry and/or another type of circuitry; the protector 370 mayinclude one or more coated electrical conductors operatively coupled toand/or part of sensor circuitry and/or another type of circuitry; themotor 350 may include one or more coated electrical conductorsoperatively coupled to and/or part of sensor circuitry, electric motorcircuitry and/or another type of circuitry; and the unit 360 may includeone or more coated electrical conductors operatively coupled to and/orpart of sensor circuitry and/or another type of circuitry.

In the examples of FIG. 3, the pump 320 can include a housing 324, theprotector 370 can include a housing 374, the motor 350 can include ahousing 354 and the unit 360 can include a housing 364. In suchexamples, a housing can include opposing ends, a longitudinal axis, anaxial length defined between the opposing ends, a maximum transversedimension that is less than the length and an interior space. As anexample, circuitry may be disposed at least in part in the interiorspace. As an example, a coated electrical conductor can be electricallycoupled to such circuitry where the coated electrical conductor includesan electrical conductor that includes copper and a length defined byopposing ends, a polymeric electrical insulation layer disposed about atleast a portion of the length of the electrical conductor, and a barrierlayer disposed about at least a portion of the polymeric electricalinsulation layer.

As an example, an interior space of an assembly may be sealed via one ormore seal elements, joints, etc. As an example, the equipment 150 ofFIG. 1 can include a sealed motor or a motor included in a sealedhousing. As an example, the equipment 170 of FIG. 1 can include a sealedhousing that aims to protect the one or more actuators 182, the one ormore sensors 184 and/or the one or more other components from fluid in adownhole environment. As an example, the one or more conductors 180 mayinclude one or more coated electrical conductors. As an example, theequipment 150 and/or the equipment 170 can be assemblies that include acoated electrical conductor electrically coupled to circuitry where thecoated electrical conductor includes an electrical conductor thatincludes copper and a length defined by opposing ends, a polymericelectrical insulation layer disposed about at least a portion of thelength of the electrical conductor, and a barrier layer disposed aboutat least a portion of the polymeric electrical insulation layer.

As to the pump 320, the motor 350, the unit 360 and the protector 370 ofFIG. 3, these may be individual assemblies that include a coatedelectrical conductor electrically coupled to circuitry where the coatedelectrical conductor includes an electrical conductor that includescopper and a length defined by opposing ends, a polymeric electricalinsulation layer disposed about at least a portion of the length of theelectrical conductor, and a barrier layer disposed about at least aportion of the polymeric electrical insulation layer. As an example, oneor more of such assemblies can include one or more sealed interiorspaces, for example, consider a housing that includes one or more sealelements, one or more joints, etc. that aim to protect circuitry, etc.,in the interior space or spaces from fluid in a downhole environment. Asan example, an assembly can include an encapsulant or encapsulatingmaterial in an interior space. As an example, an assembly can include aspecialized fluid in an interior space (e.g., a dielectric oil, etc.).

As an example, where water and/or gas (e.g., CO₂, H₂S) penetrates ahousing and enters an interior space, a coated electrical conductor caninclude an electrical conductor that includes copper and a lengthdefined by opposing ends, a polymeric electrical insulation layerdisposed about at least a portion of the length of the electricalconductor, and a barrier layer disposed about at least a portion of thepolymeric electrical insulation layer where the barrier layer acts toprotect the polymeric electrical insulation layer from the water and/orgas. In such an example, the barrier layer may prolong the useful life(e.g., operational life) of an assembly.

FIG. 4 shows a block diagram of an example of a system 400 that includesa power source 401 as well as data 402 (e.g., information). The powersource 401 provides power to a VSD block 470 while the data 402 may beprovided to a communication block 430. The data 402 may includeinstructions, for example, to instruct circuitry of the circuitry block450, one or more sensors of the sensor block 460, etc. The data 402 maybe or include data communicated, for example, from the circuitry block450, the sensor block 460, etc. In the example of FIG. 4, a choke block440 can provide for transmission of data signals via a power cable 411(e.g., including motor lead extensions “MLEs”). A power cable may beprovided in a format such as a round format or a flat format withmultiple conductors. MLEs may be spliced onto a power cable to alloweach of the conductors to physically connect to an appropriatecorresponding connector of an electric motor (see, e.g., the connector352 of FIG. 3). As an example, MLEs may be bundled within an outercasing (e.g., a layer of armor, etc.).

As shown, the power cable 411 connects to a motor block 415, which maybe a motor (or motors) of an ESP and be controllable via the VSD block470. In the example of FIG. 4, the conductors of the power cable 411electrically connect at a wye point 425. The circuitry block 450 mayderive power via the wye point 425 and may optionally transmit, receiveor transmit and receive data via the wye point 425. As shown, thecircuitry block 450 may be grounded.

As an example, a cable as in FIG. 4 can include multiple conductorswhere each conductor can carry current of a phase of a multiphase powersupply for a multiphase electric motor. In such an example, a conductormay be in a range from about 8 AWG (about 3.7 mm) to about 00 AWG (about9.3 mm).

TABLE 1 Examples of some components. Cable Component DimensionsConductor (Cu) 8 AWG to 00 AWG (3.7 mm to 9.3 mm) Insulation 58 mils to130 mils (1.5 mm to 3.3 mm) Lead (Pb) 20 mils to 60 mils (0.5 mm to 1.5mm) Jacket over Lead (Pb) 20 mils to 85 mils (0.5 mm to 2.2 mm) Armor(e.g., optional) 10 mils to 120 mils (0.25 mm to 3.0 mm) Polymeric Coat20 mils to 60 mils (0.5 mm to 1.5 mm) (e.g., optional)

As an example, a cable as in FIG. 4 may include conductors for deliveryof power to a multiphase electric motor with a voltage range of about 3kV to about 8 kV. As an example, a cable may carry power, at times, forexample, with amperage of up to about 200 A or more. As an example, acable may carry current to power a multiphase electric motor or otherpiece of equipment (e.g., downhole equipment powerable by a cable).

As noted above, in the example of FIG. 4, a conductor may be in a rangefrom about 8 AWG (about 3.3 mm) to about 00 AWG (about 9.3 mm). As tomagnet wire or other type of wire that may be insulated, a conductor maybe in a range from about 28 AWG (about 0.3 mm) to about 1 AWG (about 7.3mm). As mentioned, magnet wire may be used in construction of anelectric motor or in construction of various other types of equipment(e.g., wireline equipment, etc.).

As an example, a cable or other type of component that can be suitablefor use in a fluid environment (e.g., a submersible component) caninclude one or more types of polymers (e.g., one or more types ofpolymeric materials, etc.). As an example, a polymeric material caninclude one or more types of polymers. A polymer may be considered to bea relatively large molecule or macromolecule composed of subunits.Polymers are created via polymerization of smaller molecules that caninclude molecules known as monomers. Polymers may be characterized byphysical properties such as, for example, toughness, viscoelasticity,tendency to form glasses and semicrystalline structures, meltingtemperature, etc.

As an example, a polymeric material can be an electrical insulator. Asan example, a polymeric material can be a dielectric material that is anelectrical insulator. A dielectric material or dielectric is anelectrical insulator that can be polarized by an applied electric field.As an example, a polymeric material can be characterized at least inpart by a dielectric constant. For example, KAPTON™ polyimide film(marketed by E. I. Du Pont de Nemours and Company, Wilmington, Del.) canbe characterized by a dielectric constant that can depend on humiditywhere the dielectric constant increases with respect to increasingrelative humidity (RH), for example, from about 3 to about 4 for anincrease from about 0 percent RH to about 100 percent RH (e.g., for a 1mil film of KAPTON® type HN polymer). Such water-related changes inproperties are due to polyimide films being formed by condensationreactions. Polyimide, when exposed to water, can degrade via hydrolyticattack. The kinetics of hydrolytic degradation can depend on temperatureand pressure as well as, for example, presence of other constituents inan environment.

In Table 1, the insulation may be a polymeric material. As an example,the insulation may be a polymeric material that is or includespolyimide. In such an example, the lead (Pb) layer can be a barrierlayer that acts to protect the insulation. For example, the lead (Pb)layer can reduce permeation of water, H₂S, CO₂ or one or more otherconstituents that can degrade the insulation and/or otherwise impact itsdielectric properties (e.g., ability to insulate a conductor). Whilelead (Pb) is mentioned as a barrier material, one or more other types ofbarrier materials may be utilized, which may be, for example, one ormore of metallic material, ceramic material, and polymeric material.

As an example, a magnet wire can include insulation and a barrier layerdisposed about the insulation where the insulation may be or includepolymeric material and where the barrier layer includes barrier materialthat can reduce permeation of water, H₂S, CO₂ or one or more otherconstituents that can degrade the insulation and/or otherwise impact itsdielectric properties (e.g., ability to insulate a conductor). As anexample, a barrier material can include one or more of metallicmaterial, ceramic material, and polymeric material.

FIG. 5 shows various examples of motor equipment. A pothead unit 501includes opposing ends 502 and 504 and a through bore, for example,defined by a bore wall 505. As shown, the ends 502 and 504 may includeflanges configured for connection to other units (e.g., a protector unitat the end 502 and a motor unit at the end 504). The pothead unit 501includes cable passages 507-1, 507-2 and 507-3 (e.g., cable connectorsockets) configured for receipt of cable connectors 516-1, 516-2 and516-3 of respective cables 514-1, 514-2 and 514-3. As an example, thecables 514-1, 514-2 and 514-3 and/or the cable connectors 516-1, 516-2and 516-3 may include one or more polymeric materials. For example, acable may include polymeric insulation while a cable connector mayinclude polymeric insulation, a polymeric component (e.g., a bushing),etc. As an example, the cables 514-1, 514-2 and 514-3 may be coupled toa single larger cable. The single larger cable may extend to a connectorend for connection to a power source or, for example, equipmentintermediate the cable and a power source (e.g., an electrical filterunit, etc.). As an example, a power source may be a VSD unit thatprovides three-phase power for operation of a motor.

FIG. 5 also shows a pothead unit 520 that includes a socket 521. As anexample, a cable 522 may include a plug 524 that can couple to thesocket 521 of the pothead unit 520. In such an example, the cable 522may include one or more conductors 526. As an example, a cable mayinclude at least one fiber optic cable or one or more other types ofcables. As an example, a fiber optic cable can include a layer ofpolymeric material where a barrier layer may be disposed over the layerof polymeric material. In such an example, the barrier layer may help toprotect the layer of polymeric material from one or more constituents inan environment. As an example, a fiber optic cable may be suitable foruse in a fluid environment where the fiber optic cable is a submersiblefiber optic cable.

As explained above, equipment may be placed in a geologic environmentwhere such equipment may be subject to conditions associated withfunction or functions of the equipment and/or be subject to conditionsassociated with the geologic environment. Equipment may experienceconditions that are persistent (e.g., relatively constant), transient ora combination of both. As an example, to enhance equipment integrity(e.g., reduction in failures, increased performance, longevity, etc.),equipment may include at least one polymeric material and at least onebarrier layer disposed about at least one of the at least one polymericmaterial.

FIG. 6 shows a perspective cut-away view of an example of a motorassembly 600 that includes a power cable 644 (e.g., MLEs, etc.) tosupply energy, a shaft 650, a housing 660 that may be made of multiplecomponents (e.g., multiple units joined to form the housing 660),stacked laminations 680, stator windings 670 of wire (e.g., magnet wire)and rotor laminations 690 and rotor windings 695 coupled to the shaft650 (e.g., rotatably driven by energizing the stator windings 670).

As shown in FIG. 6, the housing 660 includes an inner surface 661 and anouter surface 665. As an example, the housing 660 can define one or morecavities via its inner surface 661 where one or more of the cavities maybe hermetically sealed. As an example, such a cavity may be filled atleast partially with dielectric oil. As an example, dielectric oil maybe formulated to have a desired viscosity and/or viscoelasticproperties, etc.

As shown, the shaft 650 may be fitted with a coupling 652 to couple theshaft to another shaft. A coupling may include, for example, splinesthat engage splines of one or more shafts. The shaft 650 may besupported by bearings 654-1, 654-2, 654-3, etc. disposed in the housing660.

As shown, the housing 660 includes opposing axial ends 662 and 664 withthe substantially cylindrical outer surface 665 extending therebetween.The outer surface 665 can include one or more sealable openings forpassage of oil (e.g., dielectric oil), for example, to lubricate thebearings and to protect various components of the motor assembly 600. Asan example, the motor assembly 600 may include one or more sealablecavities. For example, a passage 666 allows for passage of one or moreconductors of the cable 644 (e.g., or cables) to a motor cavity 667 ofthe motor assembly 600 where the motor cavity 667 may be a sealablecavity. As shown, the motor cavity 667 houses the stator windings 670and the stator laminations 680. As an example, an individual winding mayinclude a plurality of conductors (e.g., magnet wires). For example, across-section 672 of an individual winding may reveal a plurality ofconductors that are disposed in a matrix (e.g., of material ormaterials) or otherwise bound together (e.g., by a material ormaterials). In the example of FIG. 6, the motor housing 660 includes anoil reservoir 668, for example, that may include one or more passages(e.g., a sealable external passage and a passage to the motor cavity667) for passage of oil.

As an example, a shaft may be reciprocating, for example, where a shaftincludes one or more magnets (e.g., permanent magnets) that respond tocurrent that passes through stator windings.

As an example, a polymeric matrix may be formed of organic and/orinorganic monomeric and/or polymeric materials. As an example, one ormore of an epoxy, bismaleimide, polybutadiene, benzoxazine, cyanateester, silicone, Ring-Opening Metathesis Polymers (ROMP), and preceramicpolymers may be utilized.

As an example, one or more monomers and/or polymers may be amphiphilic,which may facilitate blending in one or more fillers. As an example, thefunctionalized linseed oil marketed as DILULIN™ material (Cargill, Inc.,Wayzata, Minn.) is amphiphilic and can allow for increasing content ofone or more inorganic fillers of a composite material. Where DILULIN™material is mentioned, a functionalized linseed oil other than thatmarketed as DILULIN™ may optionally be utilized.

The PubChem open chemistry database lists the following information for“Dilulin”:

PubChem CID: 102162842

Molecular Formula: C₆₂H₁₀₆O₆

Molecular Weight: 947.50144 g/mol

InChl Key: CFMHDZMTXRKWMC-PUJZDUKBSA-N

Dilulin has an IUPAC name as follows:“[3-[(Z)-octadec-9-enoyl]oxy-2-[8-[3-[(2Z,5Z)-octa-2,5-dienyl]-2-bicyclo[2.2.1]hept-5-enyl]octanoyloxy]propyl](Z)-octadec-9-enoate”. As to linseed oil, which is a triglyceride, itincludes a triester (triglyceride) derived of linoleic acid,alpha-linolenic acid, and oleic acid. As an example, Dilulin or DILULIN™material may be a modified linseed oil.

As an example, a polymeric material can be thermally conductive andelectrically insulative and be utilized to encapsulate windings of anelectric motor. Such an approach may provide for lower windingtemperatures and end coil temperatures through heat dissipation.

An electric motor may include a coil retention system such as, forexample, a full winding encapsulation type, a varnished windings type,or an end coil retention type (e.g., one that does not support wires inslots). As an example, a glass-fiber tape can be included in a coilretention system where, for example, the glass-fiber tape is wrappedaround end turns and where the glass-fiber tape is impregnated with acrosslinking resin.

As an example, an encapsulation technique can depend on the type of coilretention system employed. For example, the use of a thermosettingpolymer can depend on the type of coil retention system. An encapsulatedsystem can involve use of one or more materials and one or moreparticular processes. As an example, varnished windings approach caninclude use of a solvent-based polybutadiene system, which tends to bemore elastomeric than structural. An end coil retention resin can be asilica-filled epoxy, which has suitable structural properties due inpart to the fact that the end coil retention provides coil stabilizationwhile holding the end turns and while not supporting wires in the slots.

As an example, to maintain mechanical robustness of magnet wire wrappedin a stator of an electric motor, insulated motor windings may use acoil retention system where at least ends of coils are held in place bya structural composite that includes fibrous reinforcement (e.g., one ormore of glass, quartz, aramid, etc.) and an organic and/or inorganicpolymer matrix.

As to dielectric fluids (e.g., motor oils, etc.), consider as examplesone or more of purified mineral oils, polyalphaolefin (PAO) syntheticoils, PFPE (polyperfluoroether), etc. Such dielectric fluids can berelatively resistance to well fluid(s), which can thereby allow anelectric motor to function in case of leakage well fluid.

FIG. 7 shows an example of an electric motor 710, an example of aphotograph of a portion of an electric motor 770 and a photograph 780 ofa portion of an electric motor.

As shown in FIG. 7, the electric motor 710 includes a housing 720 withthreads 722. Lead wires (e.g., brush wires) 732 are shown where a numberof such wires can correspond to a number of phases. For example, for athree phase electric motor, there can be three lead wires 732 (e.g., twobeing shown in the cutaway view). The lead wires 732 can be associatedwith a top or uphole end of an electric motor; whereas, at a bottom ordownhole end, a wye point may exist where phases are electricallycoupled. As an example, a wye point may be electrically coupled to oneor more other components such as, for example, a gauge (e.g., a sensorunit, etc.).

As shown in the example of FIG. 7, the lead wires 732 are electricallycoupled to phase windings or phase coils where ends of the windings orcoils 734 can extend downward through slots 727 in laminations 725. Asshown in the example of FIG. 7, a polymeric material 742, which mayoptionally be a polymeric composite material (e.g., polymeric materialthat includes one or more fillers) contacts the ends of the windings orcoils 734 and a portion of the polymeric material 742 extends downwardlythrough the slots 727 in the laminations 725.

In the example of FIG. 7, a molding insert may be utilized to containthe polymeric material 742 (e.g. encapsulant material) during curing ofthe polymeric material (e.g., where reactions occur involving at leastin part monomers, etc.).

As an example, a method can include an injection process for injectingthe polymeric material 742 into a cavity of the housing 720 to contactends of windings or coils (e.g., of magnet wire), a molding process formolding the polymeric material 742 about the ends of the windings orcoils in a manner to not interfere with other components of an electricmotor (e.g., to create a shaft space and/or rotor space, etc.), anassembly process for assembling an electric motor 710 that includes thestator disposed in the housing 720 and an assembly process for assemblyof a downhole tool that can utilize the electric motor 710 (e.g., anESP, etc.).

As an example, an electric motor of an ESP may have a substantiallycylindrical shape with a diameter of about 18 cm and an axial length ofabout 10 m. In such an example, a volume of encapsulant may be of theorder of tens of liters.

As an example, for an electric motor of another type of downhole tool, avolume may be in a range where a lower limit of the range is of theorder of milliliters. As an example, a downhole tool may be a wirelinetool. As an example, a downhole tool may be a completions tool. As anexample, a downhole tool can include an electric motor that has asubstantially cylindrical shape. In such an example, consider, as anexample, a total volume of about 350 milliliters, a length of about 12cm and a diameter of about 5 cm. Of the total volume, a fraction thereofcan be encapsulant (e.g., an encapsulant volume of the order of tens ofmilliliters).

In the example of FIG. 7, the photograph 770 shows a portion of anelectric motor where resin is applied to glass fabric for the lowerportion of the windings shown in the photograph 770 (e.g., upper portionshows the glass fabric without the resin). As an example, windings canbe held in place by a polymeric material (e.g., optionally a polymericcomposite material) that completely encapsulates end turns and thatfills slots. In such an example, air voids may be substantially removedthrough use of vacuum impregnation and degassing while prepolymer isheated to a low viscosity prior to gelation.

Thermally conductive encapsulants can improve reliability of ESP systemsby decreasing motor winding temperatures. Applications can include SAGD,subsea, geothermal, etc. Such materials may be suitable for use inequipment for drilling and measurement operations (e.g., D&M).

In the example of FIG. 7, the photograph 780 of an example of a portionof a product (e.g., a portion of an example of a stator). In particular,the photograph 780 shows a lamination 781 that includes a slot 782 whereslot liner material 783 defines an interior space such that the slotliner material 783 surrounds magnet wire 792 that includes insulation791. As shown in the photograph 780, polymeric material 793, which maybe polymeric composite material, is disposed exteriorly and interiorlywith respect to the slot liner material 783. As an example, theinsulation 791 can be of the order of about 0.1 mm to about 0.3 mm. Asan example, the slot liner material 783 can be a polymeric film that maybe of one or more layers where a layer of the film may be of the orderof about 0.1 mm to about 0.3 mm. As shown, the polymeric material 793can at least partially fill spaces defined by the slot 782 of thelamination 781. As an example, an individual plate may be formed ofcarbon steel with an oxide coating where a plurality of such plates canbe stacked to form the laminations.

As an example, heat energy generated during operation of an electricmotor that includes the stator of the photograph 780 may be transferredto the polymeric material 793. For example, current in the magnet wire792 can generate heat due at least in part to resistance of the magnetwire 792. As the polymeric material 793 is in contact with the magnetwire 792 (e.g., via the electrical insulation 791) it can conduct atleast a portion of the heat energy away from the magnet wire 792, notingthat resistance of the magnet wire 792 may depend on temperature (e.g.,consider a wire where resistance increases with temperature or, in otherwords, where the wire becomes less efficient as temperature increases).

As an example, insulation may include one layer or multiple layers of ahigh temperature polymeric dielectric material. As an example, polymericinsulating material may be in the form of tape that may be appliedhelically or longitudinally (e.g., by wrapping polyimide tape onto aconductor in an overlap configuration). As an example, a polymericinsulating material may be extruded.

As mentioned, water can degrade various types of polymeric materials.For example, water phases at high temperatures (e.g. SAGD) and pressurescan rapidly degrade polyimides and thereby reduce mean time betweenfailures (MTBF) of equipment. Environments that include H₂S and watercan degrade materials. For example, sour high-pressure conditions whereH₂S and water are present, polymer insulation degradation may occur at arelatively rapid rate.

As an example, one or more methods can be utilized to manufactureinsulated conductors that exhibit resistance to water, steam, gas, etc.,which may thereby impart reliability and/or usability in particularenvironments.

As an example, a polymeric material can be a polyaryletherketone (PAEK)family polymer-based material such as, for example, polyetheretherketone(PEEK).

As an example, a polymeric material can be a fluoropolymer-basedmaterial. As an example, consider one or more fluoroelastomers such as,for example, fluoroelastomers abbreviated as FKMs. FKM (FPM by ISO) is adesignation for about 80 percent of fluoroelastomers as defined in ASTMD1418. FKMs may exhibit heat and fluid resistance. For example, in FKMs,bonds between carbon atoms of the polymer backbone and attached(pendant) fluorine atoms tend to be resistant to chain scission andrelatively high fluorine-to-hydrogen ratios can provide stability (e.g.,reduced risk of reactions or environmental breakdown). Further, FKMstend to include a carbon backbone that is saturated (e.g., lackingcovalent double bonds, which may be attack sites). Elastomers such asone or more of the VITON™ class of FKM elastomers (E. I. du Pont deNemours & Co., Wilmington, Del.) may be used (e.g., VITON™ A, VITON™ B,VITON™ F, VITON™ GF, VITON™ GLT, VITON™ GFLT, etc.).

As an example, a polymeric material may be a thermoplastic material. Forexample, consider a poly-aryl ether ketone (e.g., PEK, PEEK, PEKEKK,etc.), a melt extrudable fluoropolymer (e.g., ethylenetetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), fluorinatedethylene propylene (FEP), perfluoroalkoxy (PFA), epitaxial co-crystalinealloy (ECA) fluoroplastic, etc.), or other suitable material. As anexample, polyether ether ketone (PEEK) may be utilized as a polymericmaterial. As an example, polytetrafluoroethylene (PTFE) may be utilizedas a polymeric material.

As an example, a composition may be or include a commercially availableDuPont™ ECCtreme® ECA 3000 fluoroplastic resin (DuPont Chemicals andFluoroproducts, Wilmington Del.). As an example, such a resin may be aperfluoropolymer mixture (PFP) that may be heat aged to become an ECCPFP. As an example, a polymeric material can include epitaxialco-crystals of perfluoroalkoxy (PFA) and polytetrafluoroethylene (PTFE).As an example, perfluoroalkoxy (PFA) can be a polymer oftetrafluoroethylene and perfluorovinylether.

As an example, a polymeric material may be classified based ontemperature. For example, a low-temperature class may include materialssuch as polypropylene (PP), co-polymers of PP and polyethylene (PE),ETFE, PVDF, etc.; and, for example, a mid-temperature class may includematerials such as FEP, PFA, etc. As an example, a high-temperature classmay include materials that can withstand temperatures greater thanapproximately 260 degrees C. (e.g., approximately 500 degrees F.). As anexample, PEEK and ECA may function as insulators at temperatures inexcess of approximately 260 degrees C. (e.g., approximately 500 degreesF.).

As an example, a material can be a PEEK/fluoropolymer compositematerial. Such a material may be suitable for high temperature downholeapplications.

For high temperature and pressure applications in harsh environment asin downhole oil industry, PEEK finds use as an insulation material, suchas in high temperature cables and motor lead extensions (MLEs). As anexample, a PEEK-based cable may be rated for temperatures up to about260 degrees C. in the presence of corrosive fluids and gases, such ashydrogen sulfide (H₂S) and carbon dioxide (CO₂).

The crystalline structure of PEEK can be developed at temperatures abovethe glass transition temperature (Tg) and below the melting point. Thecrystallinity of PEEK may increase during service time in a manner thatdepends on one or more conditions (e.g., temperature, etc.). As anexample, an increase in crystallinity of PEEK during operation may leadto an increase in stiffness and a decrease in toughness. Cracks may formin PEEK insulation material after some amount of operation time, forexample, under mechanical stress.

Under hot/wet conditions, PEEK can adsorb some amount of humidity, whichcan negatively impact dielectric strength, which may allow for arctracking and consequently high electrical test failure rates in amanufacturing process. Therefore, a process may aim to develop thestructure of PEEK material to make it tougher and more water resistantunder expected operational conditions.

As an example, a material can be formed by blending PEEK with one ormore selected fluoropolymers. For example, consider one or more ofpolytetrafluoroethylene (PTFE) and perfluoroalkoxy copolymer (PFA).

As an example, one or more fillers may be electrically insulative (e.g.,relatively non-conductive). As an example, consider silica, which is agroup IV metal oxide, which has good abrasion resistance, electricalinsulation and high thermal stability. It is insoluble in acid with theexception of hydrogen fluoride (HF). As an example, a filler may be orinclude ceramic grade sand, which may be less than about 75 microns inparticle size with a silica content above about 97.5 percent whereadditional material may include less than about 0.55 percent alumina(Al₂O₃) and less than about 0.2 ferric oxide (Fe₂O₃). As an example, oneor more fillers may include silica and/or alumina and/or one or moreother materials.

As an example, thermal conductivity of a PEEK/PTFE blend and/or aPEEK/PFA blend may be enhanced via addition of one or more types ofthermally conductive ceramic fillers. For example, consider one or moreof silica, alumina and boron nitride.

As an example, inclusion of PFA and PTFE may improve toughness and waterresistance of PEEK, while a ceramic filler or fillers can improvethermal conductivity, which can offer opportunities to decreaseoperational temperatures (e.g., via improved heat transfer), which, inturn, may help to prevent overheating (e.g., or reduce time-temperaturearea experienced during operation).

As an example, consider an MLE or MLEs that are utilized in an operationwhere space constraints may exist in a downhole environment. In such anexample, reducing ampacity of a cable can be desirable as it can help toincrease current carrying capacity for a given geometry.

As an example, a composite material that includes PEEK, fluoropolymerand thermally conductive filler may be utilized in one or more pieces ofequipment such as, for example, cables, MLEs, magnet wires, and slotliners.

As mentioned, various materials can experience issues during operationat high temperature and pressure in a wet environment. For example, ahigh temperature above Tg and below the melting point can inducecrystallization of PEEK. Increasing the percentage of crystallinity ofPEEK during service time at high temperature can have a negative impacton the mechanical properties and performance of PEEK insulationmaterials. Stiffness can also increase and consequently such materialcan become more brittle (e.g., more readily generate cracks undermechanical stress). Where such phenomena occur, failure rate may beexpected to increase.

Further, as mentioned, PEEK can adsorb humidity when utilized at hightemperature in a wet environment. Adsorbed humidity can reduce thebreakdown voltage, increase dielectric constant, and may allow for arctracking that may result in electrical failure.

As an example, a composite material can include PEEK, another polymericmaterial and optionally one or more fillers where the crystallizationbehavior of PEEK may be mediated and/or PEEK may be improved as to itstoughness under operation at high temperature. As an example, such acomposite material may include or may be shielded by one or morematerials that can counter the effects of humidity.

As an example, a method can include mixing PEEK with PFA or PTFEflouropolymers to produce a compatible blend with improved mechanicalproperties as well as water resistance. PFA and PTFE tend to be highperformance flouropolymers with high dielectric strength, lowdissipation factor, chemical inertness, high hydrophobicity, andcorrosion resistance. Favorable interaction between PEEK and PFA or PTFEcan help to inhibit the crystallization process of PEEK at hightemperature, for example, as may be experienced during service time of acomponent that includes such a blend.

As an example, PFA and/or PTFE can impart elasticity to PEEK and, forexample, increase toughness.

As an example, PEEK may be a graded PEEK. For example, consider a mediumviscosity grade PEEK. As an example, PEEK 381 may be utilized (see,e.g., VICTREX™ PEEK 381G, etc.). As an example, PEEK can have a meltingpoint of about 340 degrees C. (e.g., about 343 degrees C.). As anexample, PEEK can have a glass transition temperature (Tg) of about 140degrees C. (e.g., about 143 degrees C.). As an example, PEEK may have athermal conductivity of about 0.3 W/m-k. As an example, PEEK may have amelt viscosity of about 300 Pa·s at a temperature of about 400 degreesC. As an example, PEEK may have a dielectric constant of about 3 (e.g.,about 3.2 at about 23 degrees C. and about 50 Hz).

As an example, PFA may be a graded PFA. For example, consider a mediumviscosity grade PFA. As an example, PFA 345 may be utilized (see, e.g.,TEFLON™ PFA 345, etc.). As an example, PFA can have a melting point ofabout 300 degrees C. (e.g., about 305 degrees C.). As an example, PFAmay have a thermal conductivity of about 0.2 W/m-k. As an example, PFAmay have a dielectric constant of about 2 (e.g., about 2.1 short termabout 60 Hz to about 1 GHz).

As to dielectric constant, per the theory of permittivity, in afrequency domain, the complex relative permittivity ε* of a material tothat of free space may be expressed as ε*=ε′−jε″ where the real part ε′is referred to as the dielectric constant and represents stored energywhen the material is exposed to an electric field while the dielectricloss factor ε″ is the imaginary part, which influences energy absorptionand attenuation and where j=(−1)^(0.5). Another parameter inelectro-magnetic theory is the tangent of loss angle, tan δ, which isequal to the ratio of the dielectric loss factor to the dielectricconstant. As an example, air can have a dielectric constant of about 1at a given frequency and temperature and can have an electricalconductivity of about 0 while distilled/deionized water can have adielectric constant of about 80 (e.g., 27 MHz to about 915 MHz) and anelectrical conductivity of about 0.01 S/m; whereas, 0.05 percent saltwater can have an electrical conductivity of about 3.25 S/m, whichincreases to about 173 S/m at a salt concentration of about 1 percent.

In dielectric materials, the electric field strength decreases withdistance z from the surface and may be estimated as follows: E=E₀e^(−αz)where α is an attenuation factor that depends on the dielectricproperties of the material, which can depend on the free-spacewavelength, λ₀. The temperature of a material has an effect ondielectric properties. For example, in some types of materials (e.g.,fluids, etc.) loss factor can increase with increasing temperature atlow frequencies due to ionic conductance and can decrease withincreasing temperature at high frequencies due to free water dispersion.

As an example, a material may be semi-conductive or a semiconductor. Asan example, a semiconductor can be a solid substance that exhibitsconductivity between that of an insulator and that of an electricallyconductive metal, for example, due to addition of an impurity,impurities or particles and/or due to one or more types of temperatureeffects.

As an example, a thermoplastic blend of PEEK/PFA may include a filler orfillers that can provide semi-conductive character. As an example, athermoplastic blend of PEEK/PFA may include a filler or fillers that canbe thermally conductive. As an example, a thermoplastic blend ofPEEK/PFA may include a filler or fillers that can be thermallyconductive and optionally provide one or more other types of character.As an example, a filler or fillers may be electrically insulative andoptionally provide one or more other desirable properties (e.g.,electrically insulative and thermally conductive).

As an example, a thermally conductive composite material may be preparedby mixing a blend of PEEK/PFA, a blend of PEEK/PTFE or a blend ofPEEK/PFA/PTFE with an amount of thermally conductive filler or fillers(e.g. silica, alumina, boron nitride, or mixture of them). As anexample, a thermally conductive fillers can help to reduce risk and/ortime profile of overheating and may, for example, help to decrease theoperation temperature.

As an example, a thermally conductive composite of PEEK/PFA/ceramic,PEEK/PTFE/ceramic, or PEEK/PFA/PTFE/ceramic can be tailored for aparticular application or applications (e.g., ESP cables, MLEs, magnetwires, and slot liner). Such an approach may aim to retain properties ofPEEK while mediating drawbacks as may be associated with postcrystallization, increase stiffness, decrease toughness during operationat high temperature, etc.

As an example, a polymeric composite material can be obtained throughuse of a polymer matrix filled with one or more types of particulatefillers. As an example, particulate filler may be or include aluminumoxide, aluminum nitride, boron nitride, silicon nitride and/or berylliumoxide.

Examples of some types of fillers and properties are presented in Table2, below.

TABLE 2 Examples of thermally conductive/electrically insulativefillers. Properties BN AlN Al₂O₃ SiO₂ ZnO Thermal Conductivity 300+ 26030 1.4 54 (W/m-K) Specific Heat 794  734 798 689 523 (J/kg-K) @ 25 C.Density    2.25 3.26 3.98 2.20 5.64

In Table 2, the example fillers tend to have relatively high levels ofthermal conductivity while still having relatively high dielectricstrengths.

As to shapes of fillers, alumina may be relatively spherical with arelatively low surface area while boron nitride may be plate-like;though boron nitride may be provided in a more spherical shape as anagglomerate (e.g., a spherical agglomerate). As an example, silica maybe of a more irregular shape than alumina. As an example, alumina may beof a particle size or sizes (e.g., 80 percent of particles or meanparticle size D50) that are in a range from about one micron to about200 microns. As an example, surface area of alumina may be less thanabout 0.9 m² per gram. As an example, boron nitride may be particulatewith a particle size or sizes (e.g., 80 percent of particles or meanparticle size D50) that are in a range from about 1 micron to about 500microns. Such particles may include boron nitride crystals sized fromabout 1 micron to about 30 microns. As an example, boron nitrideparticles may of a surface area less than about 100 m² per gram. As anexample, boron nitride particles may be of a dielectric constant ofabout 2 to about 5. As an example, boron nitride particles may be of athermal conductivity of about 10 to 300 or more (W/m-K).

As an example, a polymeric composite material can include alumina andboron nitride and may be relatively free of silica (e.g., less thanabout 1 percent of silica, less than about 0.5 percent silica, less thanabout 0.1 percent silica). As an example, a polymeric composite materialcan include a filler that is plate-like in shape and a filler that issubstantially spherical in shape where the two fillers may be dispersedin a polymeric matrix. In such an example, a ratio of the two fillersmay be adjusted. As an example, flow dynamics and/or properties of apolymeric composite material may be tailored by use of differentlyshaped particles (e.g., of one or more fillers) and/or differently sizedparticles (e.g., of one or more fillers).

As an example, alumina may be present in a polymeric composite materialat a volume percent up to about 65 percent of total volume of thepolymeric composite material. As an example, boron nitride may bepresent in a polymeric composite material at a volume percent up toabout 65 percent of total volume of the polymeric composite material. Asan example, alumina and boron nitride may be present in a polymericcomposite material at a volume percent up to about 65 percent of totalvolume of the polymeric composite material.

As an example, boron nitride may be present in a polymeric compositematerial at a volume percent up to about 40 percent of total volume ofthe polymeric composite material. In such an example, the polymericcomposite material may also include alumina. As an example, where boronnitride is present in a polymeric composite material, it may be presentat a volume percent of about 0.5 percent or more of total volume of thepolymeric composite material (e.g., in a range from about 0.5 percent toabout 40 percent).

FIG. 8 shows an example method 810 and an example method 850. As shown,the method 810 includes a provision block 812 for providing PEEK and oneor more fluoropolymers, an optionally provision block 814 for providingone or more fillers, a mix block 816 for mixing provided materials and aformation block 818 for forming a component based at least in part onthe mixtures of provided materials.

As shown, the method 850 includes a provision block 852 for providingpolymeric material, a provision block 854 for providing one or morefillers, a mix block 856 for mixing provided materials and a formationblock 858 for forming a component based at least in part on the mixturesof provided materials.

As shown, the method 810 can include providing thermoplastic material(s)and the method 850 can include providing thermoset material(s). As anexample, a component formed by the method 810 may be an insulationmaterial, for example, suitable to insulate a conductor or conductors.As an example, a component formed by the method 850 may be anencapsulant such as, for example, an encapsulant for a submersibleelectrical unit (e.g., a submersible electric motor).

Various example plots are shown in FIGS. 9 to 15 that can correspond toa method such as the method 810 of FIG. 8 and various example plots areshown in FIGS. 16 to 24 that can correspond to a method such as themethod 850 of FIG. 8.

FIG. 9 shows an example of a plot 900 that includes data as to angularfrequency dependence of complex viscosity for PEEK and PFA at about 370degrees C.

As an example, PEEK and PFA with one or more ceramic fillers may bemixed and melt extruded at high temperature and shear rate. In such anexample, viscosity of one or more components, particularly thethermoplastic ones (PEEK and PFA) at the processing temperature (e.g.about 370 degrees C.), can be relevant to processing.

As seen in the plot 900 of FIG. 9, data for angular frequency dependenceof complex viscosity for PEEK and PFA at about 370 degrees C. indicatedpresence of a linear viscoelastic regime. In the plot 900, markersindicate data while lines are calculated from a Cross Model:

$\eta^{*} = \frac{\eta_{0}}{1 + \left( {\omega/\omega_{c}} \right)^{\beta}}$where η₀ is zero shear viscosity, Ω_(c) is critical shear frequency andβ is a material constant.

In the plot 900, both components exhibit Newtonian behavior and shearthinning at low and high angular frequency, respectively. The viscosityof PEEK is higher than that of PFA at lower angular frequency and bothof them are about the same at about 30 rad/s. Based on such information,a process can provide for compatibility via blending PEEK and PFA atabout 370 degrees C. under shear force, particularly when the viscosityratio is about one.

FIG. 10 shows an example plot 1000 of data for temperature dependence ofstorage modulus and tan δ for PEEK/PFA blends.

In FIG. 10, the temperature dependence of storage modulus and tan δ fordifferent PEEK/PFA blends is provided based on DMA data. The dataindicate one glass relaxation process for blends with PFA content atabout 50 percent by weight or more, which is an indication of suitablecompatibility. Further, two relaxation processes can be observed for aPEEK/PFA 25/75 blend (e.g., macroscopic phase separation). Yet further,it can be observed that the storage modulus of the PEEK/PFA 75/25 blendis higher than the pure components at low temperature range. The phaseseparated blends (PEEK/PFA 25/75) tend to relatively low storagemodulus. Based on the data in FIG. 10, the PEEK/PFA 75/25 blend may besuitable for use as a polymeric material and/or as a polymeric matrix,optionally as a polymeric matrix for a composite material. For example,as a composite material, one or more fillers may be included anddispersed within the polymeric matrix. As an example, a filler orfillers may provide semi-conductive character and/or improve thermalconductivity.

FIGS. 11 and 12 show plots 1100 and 1200, respectively. The plot 1100shows DSC thermograms for PEEK/PFA blends and the plot 1200 showsmelting enthalpies of PEEK-rich and PFA-rich phases of the PEEK/PFAblends.

The melting behavior of both PEEK and PFA were also developedconsiderably by blending. The melting peak of PFA is lower than that ofPEEK and systematically shifted to higher temperature with increasingthe concentration of PEEK (see the plot 1100 of FIG. 11). However, themelting temperature of PEEK does not change by blending. Thus, two richphases exist where the percentage of PEEK dissolved in the PFA-richphase is higher than the percentage of PFA dissolved in the PEEK-richphase. The melting enthalpy calculated from the endothermic meltingpeaks of PEEK-rich and PFA-rich phases were linearly changed withcomposition as seen in the plot 1200 of FIG. 12. The data of the plots1100 and 1200 indicates suitable compatibility of the various PEEK/PFAblends.

FIGS. 13 and 14 shows plots 1300 and 1400 where the plot 1300 showstemperature dependence of dielectric constant for PEEK/PFA blends andwhere the plot 1400 shows temperature dependence of dielectric tan δ forPEEK/PFA blends.

As shown in the plots 1300 and 1400, dielectric properties of thePEEK/PFA blends improved with increasing PFA concentration. The plot1300 shows the dielectric constant versus temperature for differentblend compositions where the dielectric constant decreased withincreasing PFA content.

As shown in the plot 1400, the dielectric dissipation factor, tan δ,also decreased systematically with increasing the concentration of PFA.An increase in the resistivity with increasing PFA over wide range oftemperature was also observed.

As shown in the plot 1300 at temperatures greater than about 200 degreesC., increasing content of PFA lowers the dielectric constant (e.g.,relative permittivity). In particular, at temperatures of about 215degrees C. and higher, PEEK (e.g., greater than about 99 percent PEEK)exhibits a dielectric constant that increases dramatically withtemperature. As shown, PFA can reduce that effect such that a dielectricconstant may be relatively assured to not exceed about 10 at atemperature of about 250 degrees C. In such an example, a blend cansubstantially maintain structural properties of PEEK while assuring alack of runaway with respect to dielectric constant with respect totemperature.

As mentioned, one or more types of ceramic fillers may be included in apolymeric blend to improve thermal conductivity of a composite material.

FIG. 15 shows a plot 1500 of data for a PEEK/PFA 75/25 blend.Specifically, the data show the effect of different thermally conductivefillers on the thermomechanical properties. As seen in FIG. 15, the Tgof the PEEK/PFA 75/25 blend does not change noticeably with addition ofabout 25 percent by weight of the different thermally conductivefillers, which are alumina, silica, and boron nitride (BN). The dataindicate that the storage modulus increased by adding the differentfillers and that the magnitude of the elevation was found to be amaximum for BN when compared to alumina and silica.

As an example, a method can include tailoring the concentration of oneor more thermally conductive fillers to achieve a desired thermalconductivity, which may account for stiffness, for example, to includean amount that does not appreciably increase stiffness.

As an example, a method can include utilizing one or more surfacetreatments. For example, one or more fillers can be surface treated byone or more techniques such as, for example, plasma, electron beam,chemical functionalization, etc.

As an example, a composite material can be thermally stable afteraccelerated aging. For example, a composite material was aged at about225 degrees C. in REDA oil #5 and about 0.1 weight percent water undernitrogen gas at about 1500 psi. DMA data for PEEK/PTFE blends before andafter accelerated aging process for 7 and 14 days indicated that Tgremained substantially the same after aging and that a slight increasein the storage modulus occurred, particularly above the Tg.

As an example, a PEEK/fluoropolymer composite material can be thermallystable and exhibit suitable mechanical, thermal, and dielectricproperties. Such a composite material can also exhibit water resistance,corrosion resistance, and relatively high thermal conductivity. As anexample, such a composite material may be utilized in a cable, a MLE,magnet wire, a slot liner or another component or components that may beused in a downhole environment, etc.

As an example, a polymeric composite material can include PEEK and oneor more fluoropolymers and, for example, one or more fillers. In such anexample, one or more fillers may be selected to be in a total amount byweight of the polymeric composite material. For example, consider aselected total amount that is in a range from about 1 percent by weightto about 40 percent by weight of a polymeric composite material. As anexample, consider a selected total amount that is in a range from about2 percent by weight to about 30 percent by weight of a polymericcomposite material. As an example, consider a selected total amount thatis in a range from about 5 percent by weight to about 25 percent byweight of a polymeric composite material. As an example, a filler may beselected from a group of alumina, silica and boron nitride. As anexample, a filler may be selected from a group of alumina and boronnitride. As an example, a filler may be selected from a group of aluminaand silica. As an example, a filler may be selected from a group ofsilica and boron nitride.

As an example, a polymeric composite material can include PEEK and oneor more fluoropolymers and optionally, for example, one or more fillers.In such an example, the one or more fluoropolymers may be present at atleast approximately 5 percent by weight.

As an example, a polymeric composite material that includes PEEK mayinclude ingredients that extend an operational temperature range beyondthat of a polymeric material that is 99 percent by weight or more PEEK.For example, such a polymeric composite material may have an operationaltemperature range that extends to temperatures above about 200 degreesC. where, for example, structural aspects of PEEK are substantiallyretained. As an example, consider an operational temperature range thatextends to about 260 degrees C.

As an example, a polymeric composite material can include PEEK up toabout 50 percent by weight, can include PFA up to about 50 percent byweight and can include one or more fillers up to about 30 percent byweight. Such a polymeric composite material may be utilized in one ormore types of electrical units that may be submersible electrical units.As an example, a submersible electrical unit can be a submersibleelectric motor. As an example, a submersible electric motor can be arelatively high amperage electric motor that can benefit from inclusionof a polymeric composite material that includes one or more fillers thatincrease the thermal conductivity of a polymeric matrix within which theone or more fillers are dispersed.

As an example, a polymeric material can include about 5 percent or moreby weight of PFA. For example, such a polymeric material can includePEEK and at least approximately 5 percent by weight PFA. In such anexample, the polymeric material may be a polymeric composite materialthat includes one or more fillers. In such an example, as an example,the weight of the PFA may be at least approximately 5 percent.

As an example, a polymeric composite material can include PEEK up toabout 50 percent by weight, can include PFA from about 5 percent byweight up to about 50 percent by weight and can optionally include oneor more fillers up to about 30 percent by weight.

As an example, a polymeric material can include PEEK and PFA, PEEK andPTFE or PEEK, PFA and PTFE.

As an example, a method can include providing medium viscosity grades ofone or more polymers (e.g., PEEK, PFA, PTFE, etc.). As an example, suchgrades may correspond to medium molecular weight.

As an example, PEEK and PFA and/or PTFE with thermally conductiveceramic fillers may be mixed and melt extruded at an appropriatetemperature and shear rate. In such an example, viscosity of thecomponents, particularly the thermoplastic ones (PEEK and PFA), caneffect processing.

As an example, a polymeric composite can include one or more thermallyconductive fillers. For example, such a composite can include two ormore different types of thermally conductive fillers, which can bedifferent filler materials. For example, consider a polymeric compositematerial that includes one or more of alumina, silica and boron nitride(BN). As an example, a polymeric composite material may be utilized asan encapsulant (e.g., an encapsulant material) for an electric motor,which may be, for example, a submersible electric motor (e.g., of anESP).

As an example, a thermally conductive polymer composite material can beof suitable mechanical and dielectric properties to encapsulate portionsof an electric motor (e.g., electric motor stator, etc.). As an example,a thermally conductive encapsulant may provide for dielectricinsulation, mechanical protection, reduced operating temperature andoverheating mitigation of an ESP motor. As an example, such anencapsulant may be utilized to help protects a slot liner and/or magnetwire insulation material from thermal and/or hydrolytic degradation.

As an example, a thermally conductive composite material may include oneor more different types of polymeric matrices.

As an example, a polymeric matrix may be an epoxy resin matrix. Epoxyresins, also known as polyepoxides are a class of reactive prepolymersand polymers which contain epoxide groups.

As an example, a polymeric matrix may be formed at least in part via aring-opening metathesis polymerization (ROMP), which is a type of olefinmetathesis chain-growth polymerization. Such reactions can be driven byrelief of ring strain in cyclic olefins (e.g. norbornene, cyclopentene,etc.). A catalyst that may be used in a ROMP reaction can include ametal, for example, consider a RuCl₃/alcohol mixture, a catalyst, etc.As an example, a catalyst can be a transition metal carbene complex. Forexample, considerbenzylidene-bis(tricyclohexylphosphine)-dichlororuthenium,[1,3-bis-(2,4,6-trimethylphenyl)-2-imidazolidinylidene]dichloro(phenylmethylene)(tricyclohexylphosphine)ruthenium,Dichloro(o-isopropoxyphenylmethylene)(tricyclohexylphosphine)ruthenium(II),and[1,3-Bis-(2,4,6-trimethylphenyl)-2-imidazolidinylidene]dichloro(o-isopropoxyphenylmethylene)ruthenium.

As an example, a polymer may be formed at least in part via ROMP. Forexample, as a prepolymer component amenable to forming a polymer viaROMP, consider a carbon backbone with functional groups that include atleast one oxygen that provides an amount of hydrophilicity may bepresent along with a hydrocarbon chain (e.g., carbon backbone) thatprovides an amount of hydrophobicity where at least one functional groupmay be present on the hydrophobic hydrocarbon chain where such afunctional group may participate in ROMP (e.g., via relief of ringstress). In such an example, the prepolymer component may be an estersuch as a diester, a triester, etc. (e.g., an n-ester). As an example,consider a triester that includes at least one hydrocarbon chain with afunctional group that includes a ring that is amenable to ROMP viarelief of ring stress.

As mentioned, a ROMP process can employ a catalyst that can include ametal (e.g., Ru, etc.). As an example, a ROMP process may be utilized toform a copolymer (e.g., via two monomers, three monomers, etc.). Forexample, consider a scheme for forming a copolymer utilizing afunctionalized triester as one of the monomers. As an example, DILULIN™material (Cargill Inc., Minneapolis, Minn.) may be utilized, which is amixture of norbornyl-functionalized linseed oil and cyclopentadiene(CPD) oligomers (e.g., one fraction of modified linseed oil at about 70percent by weight and another of cyclopentadiene (CPD) oligomers atabout 30 percent by weight). In such an example, the norbornene groupsare ROMP-reactive. In such a scheme, one or more additional materialscan be included such as, for example, one or more of dicyclopentadiene(DCPD) and ethylidenenorbornene (ENB) (e.g., to form a copolymer, whichmay be a terpolymer, etc.). At room temperature, DCPD is a whitecrystalline solid. Norbornene is a bridged cyclic hydrocarbon that canbe provided as a white solid. Norbornene includes a cyclohexene ringwith a methylene bridge between C-3 and C-6; it carries a double bondwhich induces ring strain. ENB is a bicyclic monomer and intermediatethat includes two double bonds, each with a different reactivity. ENBcan be produced from vinyl norbornene, which can be made from butadieneand dicyclopentadiene DCPD.

The PubChem open chemistry database lists the following information forDCPD:

PubChem CID: 6492

Chemical Names: DICYCLOPENTADIENE; 77-73-6; Cyclopentadiene dimer;Bicyclopentadiene; Biscyclopentadiene; Dicyklopentadien; etc.

Molecular Formula: C₁₀H₁₂

Molecular Weight: 132.20228 g/mol

InChl Key: HECLRDQVFMWTQS-UHFFFAOYSA-N

The PubChem open chemistry database lists the following information forENB:

PubChem CID: 5365543

Chemical Names: Ethylidenenorbornene; Ethylidene norbornene;2-Norbornene, 5-ethylidene-; 5-ETHYLIDENE-2-NORBORNENE;5-Ethylidene-8,9,10-trinorborn-2-ene; CCRIS 4816; etc.

Molecular Formula: C₉H₁₂

Molecular Weight: 120.19158 g/mol

InChl Key: OJOWICOBYCXEKR-KRXBUXKQSA-N

As an example, a terpolymer may be a DCPD/ENB/DILULIN™ materialterpolymer (DED terpolymer). Synthesis of such a terpolymer may proceedat least in part via ROMP. For example, DED terpolymer can be cured viaROMP using transition metal chlorides (e.g., WCl₆, hexachloro tungsten)in combination with Lewis-acidic co-catalysts (e.g., EtAlCl₂,ethylaluminum dichloride). As an example, a DED terpolymer can also becured with transition metal complexes (e.g. titanium, tungsten,molybdenum, ruthenium, osmium, etc.) with organic ligands. As anexample, cationic polymerization can be accomplished using one or morecationic catalysts, such as, for example, one or more of BF₃.O(C₂H₅)₂(boron trifluoride ethyl etherate), B(C₆F₅)₃ (tris (pentafluorophenyl)borane), MAO (methylalumoxane), VCl₄ (tetrachlorovanadium), and AlBr₃(tribromoalumane).

While a terpolymer is mentioned as an example of a copolymer, ingeneral, one or more types of copolymers may be synthesized. Forexample, consider a DCPD/DILULIN™ material copolymer (DD copolymer) oran ENB/DILULIN™ material copolymer (ED copolymer).

As mentioned, a copolymer thermosets can be synthesized from DCPD and/orENB as well as a functionalized oil (e.g., as in the DILULIN™ material,etc.). Such synthesis can include ring opening metathesis polymerization(ROMP), which may employ a catalyst or catalysts (e.g., 2nd generationGrubbs' catalyst, etc.). The DILULIN™ material includesnorbornyl-functionalized linseed oil synthesized by Diels-Alder reactionof linseed oil and DCPD at high temperatures and pressures. The DILULIN™oil component, a triester, has an average of less than one bicyclicmoiety per triglyceride. The low reactivity of the DILULIN™ material dueto the low number of bicyclic moiety compared to DCPD and ENB candecrease curing kinetics, which can, for example, provide time for oneor more filling and/or impregnation process (e.g., before gelation, atransition from liquid to solid). As an example, the relatively lowviscosity of DCPD and/or ENB may be controlled by adding differentconcentrations of the DILULIN™ material.

As an example, a terpolymer or other copolymer formed via use of afunctionalized n-ester and ROMP, may exhibit toughness and adhesion to acomponent or components of an electric motor (e.g., consider magnet wireinsulation), for example, via presence of the n-ester structure.

As an example, a polymeric composite material can include one or more ofepoxy resin, blends of DCPD/ENB or terpolymers of DCPD/ENB/DILULIN™material.

As to examples of fillers, consider one or more types of inorganicceramic fillers such as, for example, boron nitride (BN), silica,alumina, and mixtures of two or more thereof.

As an example, where two or more filler materials are utilized, apolymeric composite material may be referred to as a hybrid fillerpolymeric composite material. For example, a hybrid structure impartedby use of two or more thermally conductive fillers can provide fordesired thermal conductivity and, for example, a decrease in thecoefficient of thermal expansion (CTE). Such a hybrid structure mayfurther allow for tailoring viscosity and tailoring toughness.

As an example, inorganic hybrid fillers may be substantiallyhomogenously mixed within a polymeric matrix (e.g., as a low viscosityliquid matrix) under relatively high shear force, for example, using aplanetary mixer. As an example, such a method may include in-situpolymerization.

As an example, a viscosity may be relatively low. For example, arelatively low viscosity may be achieved via use of polymeric materialsuch as DCPD/ENB or DCPD/ENB/DILLUIN™ material. Such an approach canallow for fabrication of thermally conductive composites with relativelyhigh concentrations of fillers.

As an example, a polymeric composite material can include polymer andmicro/nano-sized fillers (e.g. particles, fibers, platelets, or tubes).Such an approach may enhance properties relative to a neat polymericmatrix. As an example, a filler or fillers may help to tailor one ormore of modulus, strength, heat resistance, flame retardancy and gaspermeability. As an example, a polymeric composite material may betailored for one or more of electrical, magnetic and optical properties.

As an example, a method may include tailoring via control of one or moremicro-/nanostructural parameters such as, for example, dimension, shape,distribution, volume fraction, and packing arrangement of filler(s). Asan example, a filler concentration for substantial change in overallmaterial properties may be referred to as a threshold filler volumefraction. Enhancement of material properties in polymeric composites canbe linked to interfacial interactions between polymeric matrix andfiller(s) as well as, for example, formation of a network ofinterconnected filler particles. As an example, a network ofinterconnected particles may help to improve thermal conductivity of apolymeric matrix.

As to thermally conductive fillers, a polymeric composite material mayinclude, for example, one or more of alumina, aluminum nitride,wollastonite, boron nitride, and silicon carbide.

As to an encapsulation process of an electric motor, such a process mayutilize a polymer thermosets. For example, polybutadiene, epoxy,phenolic, acrylic, etc. may be utilized to provide mechanical protectionagainst shock and/or vibration and to help protect magnet wireinsulation materials and slot liner from degradation.

In downhole oil industry applications, an electric submersible pump maybe used in an environment that may be high temperature and high pressure(HTHP) and include one or more types of corrosive fluids and/or gases(e.g., hydrogen sulfide (H₂S), carbon dioxide (CO₂), etc.).

An ESP encapsulant material can be specified to possess suitabledielectric properties, low CTE, high glass transition temperature, highstorage modulus at operating temperature, suitable toughness, suitablethermal stability and suitable stability against hydrolytic degradationas well as, for example, relatively low viscosity before curing (e.g.,for flow, filling, gas evacuation, etc.).

High thermal conductivity of an ESP encapsulant can be beneficial whereoperating temperatures are in excess of about 200 degrees C. (e.g.,greater than about 400 degrees F.). As an example, a thermallyconductive encapsulant can help to mitigate risk of overheating and, forexample, potentially reduce operating temperature.

As mentioned, a polymeric composite material can include a selectedpolymer matrix that may include, for example, copolymers ofdicyclopentadiene (DCPD) and ethylidene-norbornene (ENB), a terpolymerthermosets of DCPD/ENB/DILULIN™ material (e.g., functionalized linseedoil), and/or an epoxy resin. As an example, inorganic thermallyconductive fillers may be selected from boron nitride, silica, alumina,and mixtures of two or more thereof. As an example, a hybrid structureof inorganic fillers may be utilized to form an interconnected networkthat can improve thermal conductivity, for example, compared to apolymeric matrix that includes a single type of inorganic filler.

To improve the thermal conductive and decrease the CTE of a polymericmatrix, a volume of thermally conductive fillers can be substantiallyhomogenously mixed with a polymeric matrix that is in a flowable state(e.g., a liquid state of suitable viscosity).

As an example, a method can include adding an amount of thermallyconductive fillers where effect on viscosity of the polymeric matrix inthe flowable state is relatively small. For example, viscosity of afilled composite can be targeted to be sufficiently low to allow ease offilling/impregnation processes with respect to one or more electricmotor structures (e.g., consider relatively narrow ESP slot stators). Asan example, a viscosity may be targeted to be sufficiently low prior tocuring to allow for formation of a relatively homogenous encapsulantthat does not entrain a substantial amount of air (e.g., relatively freeof air bubbles or other gas bubbles). For example, viscosity withrespect to time and temperature may be suitable to allow for gas bubblesto rise, optionally under influence of a vacuum, such that a setencapsulant is relatively free from voids, etc.

As an example, viscosities of DCPD/ENB and DCPD/ENB/DILULIN™ materialblends tend to be relatively low even where a method includes adding anamount of thermally conductive fillers up to about 50 percent by volume.Such examples of blends may be lower in viscosity and suitable forrelatively large amounts of fillers compared to an epoxy resin. Thus,where an epoxy resin is utilized, the amount of fillers may bedetermined at least in part via effect of such thermally conductivefillers on the viscosity of the epoxy resin (e.g., as a function offiller concentration at different temperatures).

FIG. 16 shows an example plot 1600 of temperature dependence of complexviscosity at about a 2 degrees C. per minute heating rate and at about 1radians per second angular frequency for epoxy resins with differentvolume percentages of hybrid thermally conductive fillers withouthardener (e.g., without curing).

As shown in the plot 1600, viscosity decreases with increasingtemperature due to increased mobility of polymer chains at highertemperatures. As shown in the plot 1600, mixtures with about 50 percentby volume alumina and 42/5 alumina/boron nitride percent by volume tendto have relatively low viscosities at the higher temperatures.

As an example, a polymeric composite material can include an amount ofalumina filler that may be in excess of about 30 percent by volume andoptionally an amount of boron nitride (BN) that may be in a range fromabout 0.1 percent by volume to about 10 percent by volume. As anexample, a polymeric composite material can include an amount of aluminafiller that may be in excess of about 30 percent by volume withoutincluding another type of thermally conductive filler. As an example, apolymeric composite material may be about 50/0/0 percent by volumealumina/silica/BN per the example of FIG. 16 or may be about 42/0/5percent by volume alumina/silica/BN per the example of FIG. 16. One ormore of such examples may be utilized as an ESP encapsulant where, forexample, suitable amount of hardener, etc. is included. As an example, ahybrid filler may be an alumina and boron nitride (BN) hybrid filler.

FIGS. 17 and 18 show example plots 1700 and 1800 of data as tocomposition dependence of thermal conductivity at about 25 degrees C.and at about 200 degrees C. for epoxy resins (the plot 1700) andDCPD/ENB/DILULIN™ material composites (the plot 1800). As shown in theplots 1700 and 1800, thermal conductivity increases in a relativelyexponentially manner with increasing volume percent of alumina. As shownin the plots 1700 and 1800, hybrid fillers (e.g., two or more ofalumina, silica, and BN) can increase thermal conductivity more than thesame volume percent of alumina alone (see, e.g., the arrows in the plots1700 and 1800). A polymeric composite with a hybrid filler system canallow for building interconnected structure and enhance thermallyconductivity when compared to use of a single filler (e.g., alumina).

FIGS. 19 and 20 show example plots 1900 and 2000 as to effect of filleron curing kinetics of epoxy resins composites (the plot 1900) andDCPD/ENB/DILULIN™ material composites (the plot 2000). The plot 1900 ofFIG. 19 shows curing time dependence of dynamic shear moduli (elasticmodulus, G′ and viscous modulus, G″) at about 100 degrees C. As shown inthe plot 1900, gel time may be calculated from the cross over pointbetween G′ and G″ (see arrows). As indicated in the plot 1900, gel timedecreases from about 15 min for unfilled resin to about 12 min for acomposite with about 50 percent by volume of alumina.

As shown in the plot 2000 of FIG. 20, a decrease in gel time occurs forDCPD/ENB/DILULIN™ material when loaded with about 30 percent by volumealumina (e.g., gel time decreases from about 37 min to about 23 min atabout 35 degrees C.).

In the systems corresponding to data of the plots 1900 and 2000, valuesof G′ and G″ for filled composites are higher than those of unfilledones at a substantially constant curing time.

FIGS. 21 and 22 show example plots 2100 and 2200 of data for effect ofinorganic fillers on both CTE and dielectric properties of polymericmatrices. In the plot 1900, data show CTE as a function of aluminavolume percent for epoxy resin composites at about 25 degrees C. and atabout 200 degrees C. As shown in the plot 2100, the value of CTE tendsto be quite high at about 200 degree C. compared to the correspondingvalue at about 25 degrees C. Further, CTE decreases in a relativelyexponential manner with increasing alumina concentration. As to the dataof the plot 2200, CTE values for DCPD/ENB/DILULIN™ material compositestend to be lower than those of the epoxy resin composites per the dataof the plot 2100.

FIGS. 23 and 24 show example plots 2300 and 2400 of data for dielectricproperties of epoxy resin composites with different inorganic fillercompositions at different temperatures (the plot 2300) and dielectricproperties of DCPD/ENB/DILULIN™ material composites with differentinorganic filler compositions at different temperatures (the plot 2400).As shown in the plots 2300 and 2400, the dielectric constant and tan δincrease as temperature increases while the resistivity decreases astemperature increases.

As indicated in the plot 2300, alumina can increase the dielectricconstant of epoxy resin greater than BN. The dielectric constantdecreases from approximately 32 for a composite with about 30 percent byvolume alumina to about 15 for a composite with about 25/5 alumina/BNpercentages by volume (e.g., a total of about 30 percent by volume offillers) at about 250 degrees C.

As to encapsulants, the dielectric properties of DCPD/ENB/DILULIN™material composites tend to be better than those of epoxy resincomposites. As shown in the plot 2400, the dielectric constant forDCPD/ENB/DILULIN™ material composites tends to be much lower than thoseof the epoxy resin, as shown in the plot 2300, over a relatively widerange of temperatures even for a relatively high load of filler up toabout 65 percent by volume alumina.

As an example, a polymeric composite material can exhibit a relativelyhigh thermal conductivity, a relatively low viscosity (e.g., in a liquidstate), relatively controllable curing kinetics, a relatively low CTE, arelatively high dielectric breakdown, a relatively low resistivity, arelatively low dissipation factor, a relatively high water resistance,as well as a relatively high glass transition temperature, suitabletoughness, and a relatively high storage modulus at relatively hightemperatures. As an example, such a polymeric composite material may beused in one or more types of downhole oil industry applications, forexample, as a dielectric material, an electric motor varnish, anelectric motor encapsulant, etc.

As an example, a polymeric composite material can include an amount ofone or more fillers by volume in a range from about 20 percent by totalvolume to about 50 percent by total volume. As an example, a method mayinclude mixing polymeric materials and one or more fillers in a mannerwhere viscosity is controlled or predetermined to be within a desiredrange, which may correspond to a range suitable for use of the mixtureas an encapsulant. For example, the mixture may be in a liquid statesuitable for being disposed in an electric motor housing prior tohardening.

As an example, a submersible component can include a conductor; and apolymeric material disposed about at least a portion of the conductorwhere the polymeric material includes at least approximately 50 percentby weight polyether ether ketone (PEEK) and at least 5 percent by weightperfluoroalkoxy alkanes (PFA) (e.g., perfluoro(alkoxy alkane)). In suchan example, the polymeric material can include or be a polymericcomposite material that includes a thermally conductive filler that hasa thermal conductivity greater than the polymeric material. For example,consider a thermally conductive filler that includes alumina, boronnitride or alumina and boron nitride.

As an example, a submersible component can include polymeric materialwith a dielectric constant of less than approximately 10 at atemperature of approximately 250 degrees C.

As an example, a submersible component can include a conductor; and apolymeric material disposed about at least a portion of the conductorwhere the polymeric material includes at least approximately 50 percentby weight polyether ether ketone (PEEK) and at least 5 percent by weightperfluoroalkoxy alkanes (PFA) (e.g., perfluoro(alkoxy alkane)). As anexample, consider the component being an electric submersible pump powercable, an electric submersible pump motor lead extension (MLE), anelectric submersible pump electric motor slot liner or an electricsubmersible pump magnet wire insulation.

As an example, a submersible component may be formed at least in partfrom a polymeric material that is a melt extrudable polymeric material,which may be, for example, a polymeric composite material.

As an example, a submersible electrical unit can include an electricallyconductive winding; and a polymeric composite material disposed about atleast a portion of the electrically conductive winding where thepolymeric composite material includes polymeric material at at leastapproximately 40 percent by volume and one or more fillers at at leastapproximately 10 percent by volume. In such an example, the one or morefillers can include alumina and/or boron nitride. For example, considerfillers that include alumina and boron nitride, which may optionally beof different shapes. As an example, differently shaped fillers may packin a polymeric matrix in a manner that differs from similarly shapedfillers (e.g., or a single filler of a particular shape).

As an example, a submersible electrical unit can include an electricallyconductive winding; and a polymeric composite material disposed about atleast a portion of the electrically conductive winding where thepolymeric composite material includes polymeric material at at leastapproximately 40 percent by volume and one or more fillers at at leastapproximately 10 percent by volume where the polymeric material includesdicyclopentadiene (DCPD), where the polymeric material includesethylidenenorbornene (ENB) and/or where the polymeric material includesnorbornyl-functionalized linseed oil (e.g., DILULIN™ material). As anexample, a polymeric material can include dicyclopentadiene,ethylidenenorbornene and norbornyl-functionalized linseed oil and canserve as a matrix for dispersion of one or more thermally conductivefillers therein (e.g., consider one or more of alumina and boronnitride).

As an example, a submersible electrical unit can be a submersibleelectric motor. As an example, a polymeric composite material can be anencapsulant (e.g., for a stator or other component of a submersibleelectrical unit). As an example, a polymeric composite material can be avarnish (e.g., for at least a portion of a submersible electrical unit).

As an example, a submersible component can include a conductor; and apolymeric material disposed about at least a portion of the conductorwhere the polymeric material includes at least approximately 50 percentby weight polyether ether ketone and at least 5 percent by weightperfluoroalkoxy alkanes and a submersible electrical unit can include anelectrically conductive winding; and a polymeric composite materialdisposed about at least a portion of the electrically conductive windingwhere the polymeric composite material includes polymeric material at atleast approximately 40 percent by volume and one or more fillers at atleast approximately 10 percent by volume. In such an example, thesubmersible component may be part of and/or operatively coupled to thesubmersible electrical unit. For example, consider a cable as asubmersible component that is operatively coupled to an electric motorthat is part of a submersible electrical unit (e.g., an ESP motor,etc.).

As an example, equipment 150 and/or equipment 170 of FIG. 1 mayoptionally include a submersible component that includes a conductor;and a polymeric material disposed about at least a portion of theconductor where the polymeric material includes at least approximately50 percent by weight polyether ether ketone and at least 5 percent byweight perfluoroalkoxy alkanes.

As an example, equipment 150 and/or equipment 170 of FIG. 1 mayoptionally be or include a submersible electrical unit can include anelectrically conductive winding; and a polymeric composite materialdisposed about at least a portion of the electrically conductive windingwhere the polymeric composite material includes polymeric material at atleast approximately 40 percent by volume and one or more fillers at atleast approximately 10 percent by volume.

As an example, one or more methods described herein may includeassociated computer-readable storage media (CRM) blocks. Such blocks caninclude instructions suitable for execution by one or more processors(or cores) to instruct a computing device or system to perform one ormore actions.

According to an embodiment, one or more computer-readable media mayinclude computer-executable instructions to instruct a computing systemto output information for controlling a process. For example, suchinstructions may provide for output to a sensing process, an injectionprocess, drilling process, an extraction process, an extrusion process,a deposition process, a pumping process, a heating process, etc.

As an example, a method may be computer-controlled or otherwisecontrolled at least in part via processor-executable instructions storedin a storage medium or storage media. As an example, consider control ofa mixing process, a weighing process, an extrusion process, a fillingprocess, a varnishing process, an encapsulation process, etc. As anexample, consider control of a method such as the method 810 and/or themethod 850 of FIG. 8. As an example, a portion of the method 810 and/ora portion of the method 850 may be controlled via a computing system.

FIG. 25 shows components of a computing system 2500 and a networkedsystem 2510. The system 2500 includes one or more processors 2502,memory and/or storage components 2504, one or more input and/or outputdevices 2506 and a bus 2508. According to an embodiment, instructionsmay be stored in one or more computer-readable media (e.g.,memory/storage components 2504). Such instructions may be read by one ormore processors (e.g., the processor(s) 2502) via a communication bus(e.g., the bus 2508), which may be wired or wireless. The one or moreprocessors may execute such instructions to implement (wholly or inpart) one or more attributes (e.g., as part of a method). A user mayview output from and interact with a process via an I/O device (e.g.,the device 2506). According to an embodiment, a computer-readable mediummay be a storage component such as a physical memory storage device, forexample, a chip, a chip on a package, a memory card, etc.

According to an embodiment, components may be distributed, such as inthe network system 2510. The network system 2510 includes components2522-1, 2522-2, 2522-3, . . . , 2522-N. For example, the components2522-1 may include the processor(s) 2502 while the component(s) 2522-3may include memory accessible by the processor(s) 2502. Further, thecomponent(s) 2522-2 may include an I/O device for display and optionallyinteraction with a method. The network may be or include the Internet,an intranet, a cellular network, a satellite network, etc.

Although only a few examples have been described in detail above, thoseskilled in the art will readily appreciate that many modifications arepossible in the examples. Accordingly, all such modifications areintended to be included within the scope of this disclosure as definedin the following claims. In the claims, means-plus-function clauses areintended to cover the structures described herein as performing therecited function and not only structural equivalents, but alsoequivalent structures. Thus, although a nail and a screw may not bestructural equivalents in that a nail employs a cylindrical surface tosecure wooden parts together, whereas a screw employs a helical surface,in the environment of fastening wooden parts, a nail and a screw may beequivalent structures. It is the express intention of the applicant notto invoke 35 U.S.C. § 112, paragraph 6 for any limitations of any of theclaims herein, except for those in which the claim expressly uses thewords “means for” together with an associated function.

What is claimed is:
 1. A submersible electrical unit comprising: anelectrically conductive winding; and a polymeric composite materialdisposed about at least a portion of the electrically conductivewinding, wherein the polymeric composite material comprises polymericmaterial at at least approximately 40 percent by volume and fillers atat least approximately 10 percent by volume, wherein the polymericmaterial comprises norbornyl-functionalized linseed oil anddicyclopentadiene and/or ethylidenenorbornene, and the fillers comprisealumina and boron nitride.
 2. The submersible electrical unit of claim 1wherein the polymeric material comprises dicyclopentadiene,ethylidenenorbornene and norbornyl-functionalized linseed oil.
 3. Thesubmersible electrical unit of claim 1 comprising a submersible electricmotor.
 4. The submersible electrical unit of claim 1 wherein thepolymeric composite material comprises an encapsulant.
 5. Thesubmersible electrical unit of claim 1 wherein the polymeric compositematerial comprises a varnish.
 6. A submersible electrical unitcomprising: an electrically conductive winding; and a polymericcomposite material disposed about at least a portion of the electricallyconductive winding, the polymeric composite material comprising:norbornyl-functionalized linseed oil; dicyclopentadiene and/orethylidenenorbornene; alumina filler in excess of about 30 percent byvolume; and an amount of boron nitride filler in a range from about 0.1percent by volume to about 10 percent by volume.
 7. The submersibleelectrical unit of claim 6, wherein the polymeric composite material isabout 42 percent by volume alumina filler and about 5 percent by volumeboron nitride filler.
 8. The submersible electrical unit of claim 6comprising a submersible electric motor.
 9. The submersible electricalunit of claim 6 wherein the polymeric composite material comprises anencapsulant.
 10. The submersible electrical unit of claim 6 wherein thepolymeric composite material comprises a varnish.